Water based semi-permanent release agent designed for use with heated tools (250F-350F). Excellent for compression molding of epoxy, phenolic and polyester resins
Description
Water based semi-permanent release agent designed for use with heated tools (250F-350F). Excellent for compression molding of epoxy, phenolic and polyester resins
Video
Description
Water based semi-permanent release agent designed for use with heated tools (250F-350F). Excellent for compression molding of epoxy, phenolic and polyester resins
Video
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